Products
Newsletters
Presentations
Technical Data
Resources
Free ground shipping now available for all orders placed online. Click Here
Eichrom Technologies, LLC
- Tel: (630) 963-0320
- Fax: (630) 963-1928
- Email: info@eichrom.com
Eichrom Technologies, Inc.
North American Users' Group Workshop
Westminster, CO
May 2, 2002
Viewing Presentations Online:
Simply click on the link for each Presentation
Windows Users:
To download a presentation or Word document, please Right-Click on the Download link for
each Presentation and choose the "Save as source..." option and then specify where you would like the file saved.
Macintosh Users:
Simply click on the download link and specify where you would like the file saved.
| Agenda | ||
| 8:30 a.m. | Registration and Continental Breakfast | |
| 9:15 a.m. | Welcome and Introductions | Lawrence Jassin, Eichrom Technologies, Inc. |
| 9:30 a.m | Rapid Separation Methods for Bioassay Samples | S.L. Maxwell, III and D.J. Fauth, Westinghouse Savannah River Site |
| 10:15 a.m | The Determination Of 226Ra in Water Samples | Anil H. Thakkar and Michael Fern, Eichrom Technologies, Inc. |
| 10:50 a.m. | Break | |
| 11:05 a.m | MnO2 Resin: Concentration of Radium Isotopes | Deok-Soo Moon and Bill Burnett, Florida State University, and E.P. Horwitz, PG Research Foundation, Inc. |
| 11:40 a.m | Purification of Radionuclides for Nuclear Medicine: The Multicolumn Selectivity Inversion Generator Concept |
E.P. Horwitz and A.H. Bond, PG Research Foundation, Inc. |
| 12:00 noon | Lunch | |
| 1:30 p.m. | Technical Updates on UTEVA Resin and TEVA Resin | Anil H. Thakkar and Michael Fern, Eichrom Technologies, Inc. |
| 2:05 p.m | Elution and Mounting Techniques for Americium using Eichrom TRU Resin |
Mitch Abbate Severn Trent Services St. Louis |
| 2:30 p.m. | Break | |
| 2:50 p.m. | Eichrom's Process-Scale Resin Portfolio | E. Phillip Horwitz, Senior Consultant Eichrom Technologies, Inc. |
| 3:35 p.m | Access to Eichrom's Technical Resources | Michael Fern, Eichrom Technologies, Inc. |
| 4:00 p.m. | Concluding Remarks | Michael Fern, Eichrom Technologies, Inc. |